Semiconductor Adhesiveless Lamination

Adhesiveless Lamination

ADHESIVELESS LAMINATES — UNSURPASSED PERFORMANCE

Traditional laminates are notoriously unreliable at temperatures which exceed the Glass Transition (Tg) of the adhesives used in their constructions.

KAPTON® and CIRLEX® laminates use adhesiveless bonding technology unique in the marketplace today.  Eliminate the adhesive and you eliminate the weak link in the chain.

Use of all polyimide bonding eliminates the adhesive interface where many problems occur.  Polyimide is closely matched to the CTE of copper, and can also be used to bond many other metals with bond strengths typically > 10 pli.

If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and solvent resistance; you need adhesiveless laminate technology.

For additional information about us or to begin discussions on your project, click our Quote Request, or call 1-800-FRALOCK (372-5625)

***CIRLEX® is a registered trademark of DUPONT used under license by FRALOCK.

***KAPTON® is a registered trademark of DUPONT.