Semiconductor Gap Fillers

GAP FILLERS

GAP FILLER PIC

Fralock offers Gap Pad / Gap Fillers for the thermal interface material family to meet the electronics industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application.

Gap Pad/Gap Fillers provide an effective thermal interface between components and electronic components where uneven surface topography, air gaps, and rough surface textures are present. Gap Pad provides:

Elimination of air gaps to reduce thermal resistance

High conformability to reduce interfacial resistance

Low-stress vibration dampening

Compatible with automated dispensing equipment

Contact us directly for further information. Request a quote online or Call us at 1-800-FRALOCK (372-5625)