Aerospace Adhesiveless Laminates

ADHESIVELESS LAMINATES — UNSURPASSED PERFORMANCE

Adhesiveless laminates provide high temperature resistance, dimensional stability, low outgassing, durability, and solvent resistance.  Traditional laminates are notoriously unreliable at temperatures which exceed the Glass Transition (Tg) of the adhesives used in their constructions.

KAPTON^® and CIRLEX^® polyimide laminates use adhesiveless polyimide bonding technology unique in the marketplace today. Eliminate the adhesive and you eliminate the weak link in the chain.

Use of all polyimide bonding eliminates the adhesive interface where many problems
occur. Polyimide is closely matched to the CTE of copper, and can also be used to bond many other metals with bond strengths typically > 10 pli.

If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and solvent resistance; you need adhesiveless polyimide laminate technology.

Unsurpassed Reliability with All Polyimide Fully Encapsulated Designs
• All polyimide bonding eliminates the adhesive interface where most problems occur

• Full encapsulation eliminates the voids around metallic traces that create performance variables and structural discontinuities that affect durability

• Laminate bond strengths exceed substrate properties and that typically exceeds 10 pli to metallic traces

• Wide operational temperature range -269°C to +351°C (Tg)

If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and chemical resistance, you need Fralock’s all polyimide adhesiveless laminate

Contact Fralock directly for further information. Request a quote online or Call 1-800-FRALOCK (372-5625)

***CIRLEX^® is a registered trademark of DUPONT used under license by FRALOCK.

***KAPTON^® is a registered trademark of DUPONT.