AEROSPACE ADHESIVELESS LAMINATES — UNSURPASSED PERFORMANCE!
Aerospace Adhesiveless laminates are changing the way engineers design. Adhesiveless laminates provide high temperature resistance, dimensional stability, low outgassing, durability, and solvent resistance. Traditional polyimide laminates are notoriously unreliable at temperatures which exceed the Glass Transition (Tg) of the adhesives used in their constructions.
KAPTON® and CIRLEX® polyimide laminates use all polyimide adhesiveless bonding technology unique in the marketplace today. Eliminate the adhesive and you eliminate the weak link in the chain.
Use of all polyimide laminate bonding eliminates the adhesive interface where many problems occur. Polyimide is closely matched to the CTE of copper, and can also be used to bond many other metals with bond strengths typically > 10 pli.
If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and solvent resistance; you need adhesiveless laminate technology.
All Polyimide, Aerospace Adhesiveless Laminates
Fralock’s unique materials and ALT allows it to develop and produce a wide range of ultra high reliability products that offers key advantages, including:
Unsurpassed Reliability with All Polyimide Fully Encapsulated Designs
If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and chemical resistance; you need Fralock’s all polyimide adhesiveless laminates.
For additional information about us or to begin discussions on your project, click our Quote Request, or call 1-800-FRALOCK (372-5625)
***CIRLEX® is a registered trademark of DUPONT used under license by FRALOCK.
***KAPTON® is a registered trademark of DUPONT.