Aerospace

All Polyimide Adhesiveless Laminates

Flexible and Rigid-Flex designs are fully encapsulated. Applications include: Antennas, Solar Arrays, Circuits, Shields, Heaters, Reflectors, Custom Composites, Shims, and Mechanical Seals.
All Polyimide Design Advantages

Robust Handling: Virtually eliminates fragility related assembly damage, rework and delays.

Full Folding: May be folded over without affect.

No Solder joints or Connectors: Continuous panels to 120” and Full Folding can result in continuous lengths to 100’s of feet without any unreliable connections.

Fine Line/Trace and Spacing: to 1 mil, allows compact design.

Low Mass: Superior materials, lamination, trace/spacing and connector elimination yields lower mass.

Exceptional Radiation Resistance: Retains physical, thermal, electrical and isolation properties throughout extended mission life.

Unsurpassed Reliability with All Polyimide Fully Encapsulated Designs

• All polyimide bonding eliminates the adhesive interface where most problems occur.
• Full encapsulation eliminates the voids around metallic traces that create performance variables and structural discontinuities that affect durability.
• Laminate bond strengths exceed substrate properties that typically exceed 10 pli to metallic traces.
• Wide operational temperature range -269°C to +351°C (Tg)

DuPont^TM CIRLEX^®

Characteristics and Features:

• Abrasion resistant
• Chemically inert
• Dielectric Strength up to 7000 volts/mil
• Glass transition temperatures up to 351°C (663°F)
• Low CTE, 30 ppm in-plane at temperatures -269°C (ASTM E831)
• Meets specifications:
• Tested and Meets NASA outgassing requirements
• Flammability requirements of UL94V-0 (UL file #E39505)
• Inherently Halogen free
• Maintains its mechanical properties at extreme temperatures, from cryogenic-269°C (-516°F) to over 351°C (663°F)
• Monolithic polyimide construction with no adhesive weaknesses
• Readily modified by machining, drilling, laser machining
• Thermal & Dimensional Stability
• High Performance – Dimensional stability over high temp range: -452°F to 663°F, 94 V-O flammability rating.
• Thermal Cycling tested from -186°C to 150°C

If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and chemical resistance, you need Fralock’s all polyimide adhesiveless laminates.

Custom material combinations are available in both rolled goods and die cut parts. For additional information about us or to begin discussions on your project, click here to Request a quote or Call us at 1-800-FRALOCK (372-5625)

Fralock is DuPont^TM ’s sole licensee for the production of CIRLEX^® worldwide

***CIRLEX^® is a registered trademark of DuPont^TM used under license by FRALOCK.