FRALOCK is an AS-9100 registered and ITAR compliant manufacturer/converter of flexible materials such as adhesive tapes, films, foils, foam, rubber, specialty laminates, and custom composites in the Aerospace market.  These materials are used in various components for aircraft, spacecraft, satellites, and space based solar arrays among others. Fralock’s Technical KnowledgeTM (FTK) allows us to combine seemingly incompatible materials for mission-critical applications.


All Polyimide Adhesiveless Laminates

Flexible and Rigid-Flex designs are fully encapsulated. Applications include: Antennas, Solar Arrays, Circuits, Shields, Heaters, Reflectors, Custom Composites, Shims, and Mechanical Seals.

Our flexible and Rigid Flexible PCB meet IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards 

All Polyimide Design Advantages

Robust Handling: Virtually eliminates fragility related assembly damage,
rework and delays.

Full Folding: May be folded over without affect.

No Solder joints or Connectors: Continuous panels to 120” and
Full Folding can result in continuous lengths to 100’s of feet without any unreliable connections.

Fine Line/Trace and Spacing: to 1 mil, allows compact design.

Low Mass: Superior materials, lamination, trace/spacing and connector elimination yields lower mass.

Exceptional Radiation Resistance: Retains physical, thermal, electrical and isolation properties throughout extended mission life.

Unsurpassed Reliability with All Polyimide Fully Encapsulated Designs

All polyimide bonding eliminates the adhesive interface where most problems occur.

Full encapsulation eliminates the voids around metallic traces that create performance variables and structural discontinuities that affect durability.

Laminate bond strengths exceed substrate properties that typically exceed 10 pli to metallic traces.

Wide operational temperature range -269°C to +351°C (Tg)


CIRLEX® is currently used as a high temperature/thermal block in military aircraft engine systems. Additional benefits include compression resistance and chemical resistance. CIRLEX® offers dimensional stability over a broad temperature range: -452°F to 664°F, and has 94 V-O flammability rating.

Characteristics and Features:

  • Abrasion resistant
  • Chemically inert
  • Dielectric Strength up to 7000 volts/mil
  • Glass transition temperatures up to 351°C (663°F)
  • Low CTE, 30 ppm in-plane at temperatures below -269°C (ASTM E831)

Meets specifications:

  • NASA outgassing requirements
  • Flammability requirements of UL94V-0 (UL file #E39505)
  • Inherently Halogen free
  • Maintains its mechanical properties at extreme temperatures, from cryogenic-269°C (-516°F) to over 300°C (572°F)
  • Monolithic polyimide construction with no adhesive weaknesses
  • Readily modified by machining, drilling, laser machining
  • Thermal & Dimensional Stability
  • High Performance – Dimensional stability over high temp range: -452°F to 664°F, 94 V-O flammability rating.
  • Thermal Cycling tested from -186°C to 150°C

If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and chemical resistance, you need Fralock’s all polyimide adhesiveless laminates for the Aerospace Market.

Custom material combinations are available in both rolled goods and die cut parts.  For additional information about us or to begin discussions on your project, click here to Request a quote or Call us at 1-800-FRALOCK (372-5625)


***CIRLEX® is a registered trademark of DUPONT used under license by FRALOCK.

aerospace market

  • AS9100
  • ISO9001
  • Adhesion & Bonding Systems
  • EMI / RFI Shielding
  • Electrical Insulation
  • Gasketing & Sealing
  • Thermal Management

For additional information about us or to begin discussions on your project, click our Quote Request, or call 1-800-FRALOCK (372-5625)