Market demand for continuously shrinking chip sizes forces manufacturers to develop new Engineered Material Solutions for improved manufacturing processes to create these advanced devices with fine, closely packed features. Creating these ever-smaller microprocessors and memory devices for today’s products is extremely challenging and requires pin-point control at the microscopic level. This level of control requires precision Engineered Material Solutions to facilitate the extreme manufacturing temperatures and pressures required to achieve success.
The etching process of semiconductor manufacturing pushes the boundaries of physics, chemistry and thermodynamics, and requires precision Engineered Material Solutions for consistent results. Fralock has the materials and the expertise to provide solutions to several of these challenges, including: