Polyimide materials have many years of proven success in space applications because of their mechanical properties. Polyimide clad laminates provide several advantages in space applications where both thermal and mechanical stability, as well as, radiation resistance are necessary.Fralock’s unique All Polyimide Lamination technology eliminates the adhesive (the weak link), thereby allowing for higher performance with no trace swimming. With complete Encapsulation of metallic traces voids are eliminated.? Additionally, we achieve a higher bond strength with a ‘mechanical bond’. Our all polyimide clad laminates are modifiable using CNC’s, laser cutting, CO2 laser cutting, and etching.


  • Chemically inert
  • Abrasion resistant
  • Dielectric strength > 2500 volts/mil
  • Glass transition temperature 351°C/663°F
  • Mechanical properties at extreme temps, from -269°C (-516°F) to over 300°C (572°F)
  • Low CTE, 30 ppm in-plane at temperatures below -269°C (ASTM E831)
  • Low Thermal Conductivity: 0.17 W/m*K
  • Meets specifications: NASA outgassing requirements and Flammability requirements of UL94V-0
  • Inherently Halogen free


Flex Circuits


Solar Array Components

EMI shielding

RFI Shielding

Flexible Heaters


Specialty Sealing and Gaskets

Thermal and Electrical Solutions


Satellite Communications

Satellite Communications


  • Adhesion & Bonding Systems
  • EMI / RFI Shielding
  • Electrical Insulation
  • Gasketing & Sealing
  • Thermal Management


For additional information about us or to begin discussions on your project, click our Quote Request, or call 1-800-FRALOCK (372-5625)