Semiconductor Adhesiveless Lamination

Adhesiveless Lamination


Eliminate the adhesive and you eliminate the weak link in the chain.  DuPontTM KAPTON® and DuPontTM  CIRLEX® laminates use adhesiveless bonding technology, unique in the marketplace today.  Traditional laminates are notoriously unreliable at temperatures which exceed the Glass Transition (Tg) of the adhesives used in their constructions.

Use of all polyimide bonding and eliminate the adhesive interface where many problems occur.  Polyimide is closely matched to the CTE of copper, and can also be used to bond many other metals with bond strengths typically > 10 pli.

If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and solvent resistance; you need adhesiveless polyimide laminate technology.

For additional information about us or to begin discussions on your project, click our Quote Request, or call 1-800-FRALOCK (372-5625)

CIRLEX® Data Sheet -PDF