Semiconductor Adhesiveless Laminates

Adhesiveless Polyimide


Traditional laminates are notoriously unreliable at temperatures which exceed the Glass Transition (Tg) of the adhesives used in their constructions.

DuPontTM KAPTON® and DuPontTM CIRLEX® polyimide laminates use adhesiveless polyimide bonding technology unique in the marketplace today. Eliminate the adhesive and you eliminate the weak link in the chain.

Use of all polyimide bonding eliminates the adhesive interface where many problems occur. Polyimide is closely matched to the CTE of copper, and can also be used to bond many other metals with bond strengths typically > 10 pli.

If your application requires high temperature resistance, dimensional stability, low outgassing, durability, and solvent resistance; you need adhesiveless polyimide laminate technology.

Contact Fralock directly for further information. Request a quote online or Call 1-800-FRALOCK (372-5625)