Consistency of temperature across a wafer becomes more challenging as wafer diameters expand. Fralock’s expertise in Thermal Management Solutions not only include Gap Fillers and Thermal Spreaders, but also very complex, All-Polyimide Heaters.
- Gap Fillers – We can assist in selection and precision manufacturing of complex thermal management fillers with very high thermal conductivity in the thru-plane, providing excellent heat transfer across a platen or wafer.
- Thermal Spreaders – When trying to distribute heat and normalize temperature across a large diameter wafer, Fralock can assist with materials with exceptional thermal conductivity in the X-Y plane. These materials are unparalleled in thermal spreading properties.
- All-Polyimide Heaters – Whether used as chamber liners or in multi-zone heaters, Fralock’s all-polyimide heater solutions allow unparalleled and uniform coverage and consistency over an entire wafer surface. Extremely thin (< 10 mil) with very high Watt Density capability, our heaters are as efficient as the thermal management keeping up with heat generation.