Semiconductor Thermal Management
Consistency of temperature across a wafer becomes more challenging as wafer diameters expand. Fralock’s expertise in Thermal Management Solutions not only include Gap Fillers and Thermal Spreaders, but also very complex, All-Polyimide Heaters.
- Gap Fillers – We can assist in selection and precision manufacturing of complex thermal management fillers with very high thermal conductivity in the thru-plane, providing excellent heat transfer across a platen or wafer.
- Thermal Spreaders – When trying to distribute heat and normalize temperature across a large diameter wafer, Fralock can assist with materials with exceptional thermal conductivity in the X-Y plane. These materials are unparalleled in thermal spreading properties.
- All-Polyimide Heaters – Whether used as chamber liners or in multi-zone heaters, Fralock’s all-polyimide heater solutions allow unparalleled and uniform coverage and consistency over an entire wafer surface. Extremely thin (< 10 mil) with very high Watt Density capability, our heaters are as efficient as the thermal management keeping up with heat generation.
Many of today’s greatest technological advancements have one thing in common: a need to manage heat from the device to assure its reliable performance over the long term. Whether it is controlling process temperatures in semiconductor wafer manufacturing or getting rid of excess heat generated by power electronics or devices, heat transfer is critical to a wide range of applications that enable our modern lives.
For additional information about us or to begin discussions on your project, click our Quote Request, or call 1-800-FRALOCK (372-5625)