Adhesiveless Lamination Technology (ALT)
- Adhesiveless Lamination Technology (ALT)™
Fralock is the manufacturer of a highly durable and rugged all-polyimide material constructed with our proprietary Adhesiveless Lamination Technology (ALT)™. We use this technology to bond layers of polyimide to produce a monolithic material that is able to operate in extreme environmental conditions for extended time without cracking or delaminating. ALT material is ideal for critical applications in industries such as aerospace, military defense, medical, industrial, and energy.
- ALT Dura™ Products
ALT Dura™ products are components made using Adhesiveless Lamination Technology (ALT)™, providing custom solutions for our customers in a wide range of applications. These products include flexible interconnect circuits and heaters.
Flexible Interconnect Products – ALT Dura™ flex circuits are fully encapsulated with polyimide, protecting the traces from environmental disturbances and degradation. The flex circuits, harnesses and heaters can withstand delamination in demanding conditions such as hard creasing and repetitive flex cycles. Additionally, ALT Dura™ products offer superior resistance to trace swimming under high temperatures and 30% reduction in mass compared with traditional flex products laminated with temperature-limiting adhesives. ALT Dura™ circuits also exhibit a wide temperature operational tolerance, from -269°C to 220°C (-452°F to 428° F).
ALT Dura™ Applications Include:
- Wafer heaters for semiconductor manufacturing
- Polyimide heaters encapsulated with metal (Al, Cu, stainless steel)
- Flexible board-to-board connectors - rigid-flex design allows multiple layers of polyimide and metallization
- Flex-to-board connectors, BGA and LGA sockets - provides high-reliability and performance in molding operations
- Medical diagnostic instruments
- All-polyimide circuit boards
Fralock partners with you to design, engineer, fabricate, test, and manufacture custom ALT Dura™ products to satisfy your demanding requirements.
