Leading the Way in Advanced Materials Solutions

Flex & Rigid/Flex Solutions

Polyimide flex circuits, cables, and heaters designed and manufactured by Fralock are critical components for major OEM’s in technically advanced markets. We provide single and multi-layer fine-pitch flexible circuits where applications require interconnections in a compact package. Our All-Polyimide flex solutions are smaller, lighter, and can seamlessly integrate into almost any form you need.

Fralock builds flex circuits and heaters to your exact specifications with predictable performance. High-reliability rigid-flex circuits, which combines a flex circuit with a rigid conductor such as a connector or a circuit board, can be found in applications ranging from medical devices to aircraft guidance systems. With a low profile, compact outline, bendable capability, and low weight, Fralock flex and rigid-flex circuits are commonly used in a wide variety of industries.

Our flexible heaters feature etched metal tracings between two sheets or strips of polyimide material. These thermofoil heaters are ideal for applications that require complex shapes and contours, as well as those with tight space and weight constraints.

Fralock’s etched foil cables can be folded without affecting performance. Our capabilities include production of flex circuits and heaters without any adhesives, using our Adhesiveless Lamination Technology (ALT). Eliminating the need for adhesives also enables tolerance to a wider range of temperatures, from -269° to 220° Celsius (-452° to 428° Fahrenheit) and renders them about 30 percent thinner and lighter, saving space and labor costs.  ALT Dura™ flex products are flex circuits and heaters made using ALT technology.

Our flex circuit services include consignment, quick-turn, prototyping, production, and complete turnkey builds.

Superior performance is achieved with Fralock polyimide flex and rigid-flex circuits, flex cables and heaters.

Applications of Flex and Rigid-Flex Circuits
Featured Benefits:
  • Adhesiveless construction resulting in more rugged, thinner, lighter and more flexible circuits
  • Higher density circuits: trace and space capabilities down to 1.5 mil
  • Microvia sizes down to .002″ diameter for high density, 2-layer flex circuits
  • Selective plating of gold and tin leads enables multiple attachment methods on the same All-Polyimide flex circuits
  • Alternate circuit layer materials such as beryllium, copper, stainless steel, and nickel can be used for optimum performance in unique applications
  • Leaded and Lead-Free Assemblies
Applications include:
  • Compact assemblies where electrical connections are required in 3 axes (static application)
  • In space-constrained applications that prohibit the use of thicker circuit boards or wire harnesses
  • Electrical connections where the assembly is required to flex during its use (dynamic application)
  • Weight-sensitive applications such as hand-held devices, aircraft, or spacecraft where they replace heavier and bulkier wire harnesses
  • High-performance applications where heat or insulation requirements preclude typical insulation materials
Polyimide Flexible Cables
Configurations:
  • Single-Sided Flex Circuits (single or multiple access)
  • Double-Sided Flex Circuits
  • Multi-Layer Flex Circuits
  • Rigid-Flex Circuits
  • Extended Length Flex Circuits
  • Full Turnkey Assemblies
Manufacturing Capabilities:
  • Trace / Space 37um (1.5 mil)
  • Micro / Vias Min 50u (2 mil)
  • Blind/Buried Vias (2mil)
  • Via Fill (conductive and non-conductive)
  • Laser- Precision Drilling / Excising<50um (2mil)
  • Layer Count Capability 1-30
  • Unsupported Traces / Cantilever Leads
  • Controlled Impedance Routing Capabilities
  • Surface Mount Technology (SMT) and thru-hole assembly services.
  • Gold Plating (ENIG and Hard Gold)
  • Liquid Soldermask Thickness 25um (1mil)
  • Photo Imageable Coverlay Min 25um (1mil)
  • RoHS & Non RoHS PCB/Flex Circuit Manufacturing
  • Automated Optical Inspection (3D AOI)
  • X-Ray, CT Scan
  • Electrical Testing (Flying Probe, Functional Test , and Hi-Pot)
Configurations:
  • Single-Sided Flex Circuits (single or multiple access)
  • Double-Sided Flex Circuits
  • Multi-Layer Flex Circuits
  • Rigid-Flex Circuits
Manufacturing Capabilities:
  • Trace / Space 37um (1.5 mil)
  • Micro / Vias Min 50u (2 mil)
  • Blind/Buried Vias (2mil)
  • Laser- Precision Drilling / Excising<50um (2mil)
  • Layer Count Capability 1-10+
  • Unsupported Traces / Cantilever Leads
  • Controlled Impedance Routing Capabilities
  • Liquid Soldermask Thickness 25um (1mil)
  • Photo Imageable Coverlay Min 25um (1mil)
  • RoHS & Non RoHS PCB/Flex Circuit Manufacturing
  • Automated Optical Inspection (AOI)
  • Electrical Testing (Flying Probe, Function, and Hi-Pot)
  • Ability to Test for 10-15 Resistance Leakage

Our flexible and Rigid Flex PB meets IPC-6013: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

  • UL Certified
  • J-Standard Certified

We provide flex circuit solutions in industries such as Aerospace/Defense, Medical, Semiconductor, Industrial, Electronics, and Energy.

Learn about our flex products.