Interface Materials - Overcoming Problems in Electronic Systems
Many processes in electronic systems rely on rely on efficient transfer of heat. Fralock’s interface solutions include thermal management materials and parts that incorporate advanced materials that spread heat and enable uniform thermal distribution and thermal transfer, or block heat to prevent thermal transfer. These products are used for a wide variety of applications in many industries where temperature management is critical for optimal performance.
Other challenges include electromagnetic and radio frequency interference, vibration and shock, protection from plasma, and electrical insulation. Fralock has helped customers for over 55 years to overcome these challenges with an array of specialty engineered materials and solutions.
Heat Spreading - Thermal Interface Material (TIM)
Spreading heat with thermal interface materials (TIMs) can improve thermal uniformity in some electronics applications, inhibiting heat buildup in some areas, and creating thermal balance in a system. Thermal dissipation and heat transfer materials are typically graphite, metal, and conductive elastomeric or silicone-based films, or combinations of the these materials.
Fralock provides custom engineered thermal interface materials and components to satisfy your specific requirements. Our experienced team of material science specialists will help engineer the right component for your application.
Heat Blocking and Thermal Protection Barriers
Thermal Protection Barriers and thermal blockers are used for preventing overheating of electrical components and touch protection. Materials are typically polyimides, silicone foams, and combinations of these, which can be combined with thin metals for structural integrity. Materials can be stacked to provide protection from scratches and static build-up.
Vibration Dampening, Sound Attenuation, Attachment
Vibration and shock can present problems in non-stationary and high vibration systems. Excessive jostling or impact can lead to component failure, reduced lifespan, and compromised performance. For signal distribution, it can induce noise and interfere with signal integrity in electronic circuits.
Fralock can provide a custom gaskets, seals, or pads to dampen the effects of shock and vibration with engineered foams and rubbers that are well-suited to your application.
Electrical insulation is crucial in electronics systems to prevent unwanted electrical conduction between different components and conductive elements. Poor electrical insulation can lead to electrical shorts, component damage, or system failure from dielectric breakdown and high voltage stress. Proper material selection, design optimization, and adherence to industry standards and regulations are critical in achieving effective electrical insulation. Fralock offers a range of material solutions and engineering expertise for your application.
Fralock has pioneered the development of Teflon-encapsulated polyimide for plasma protection. Used in semiconductor etch processes, components made from this material extends the lifetime of Teflon materials by mitigating deformation of Teflon components.
Electromagnetic interference (EMI) and radio frequency interference (RFI) occur when electronic devices, equipment or systems are exposed to electromagnetic sources – either man-made or naturally occurring – that results in electronic disturbances. These perturbations can range from minor temporary disturbances like a power spike to outages causing permanent failures such as data loss, system failure, and even loss of life.
We offer EMI/RFI shielding solutions using a wide array of materials for your most challenging applications.
Let us assist you with your next project to design, engineer and manufacture advanced material components for thermal management and other interface solutions. Fralock’s experienced engineers and precision manufacturing can help overcome your manufacturing challenges for your most demanding applications.