Leading the Way in Advanced Materials Solutions

Semiconductor

Market demand for continuously denser and smaller semiconductor chips forces manufacturers to develop solutions for semiconductor equipment that continuously pushes the envelope of current capabilities, and requires precision engineering for consistent results. Fralock assists equipment manufacturers by providing engineered solutions in many areas, with expertise in:

  • Ceramics – with and without active circuitry
  • Flex cabling and circuitry, including flex and rigid-flex configurations
  • Thermal management materials for improving uniformity and distributing/blocking heat
  • Heating technology that includes complex assemblies like ceramic showerheads, polyimide e-chucks, and heater modules.

The primary industry segments we serve include semiconductor front-end equipment as well as back-end test and packaging equipment.

Semiconductor Flex Manufacturer
Semiconductor Engineered Materials

Semiconductor Equipment Engineered Materials Solutions

Advanced engineered materials components are essential for semiconductor equipment manufacturers. These solutions encompass a range of advanced materials tailored specifically to meet the complex and demanding needs of semiconductor fabrication processes.

The semiconductor industry requires engineered materials that include high efficiency thermal management (e.g., heat dissipation) components, using advanced thermal interface materials (TIMs) and high-conductivity substrates. In addition, engineered materials with low electrical resistance and high dielectric strength are essential for signal integrity and reduced power loss.

Semiconductor industry engineered materials can provide improved resistance to wear, corrosion, and chemical exposure, ensuring that equipment maintains its performance over extended periods. This means lower maintenance costs, less downtime, and substantial cost savings for manufacturers.

Fralock’s proprietary technologies, materials, and supplier relationships allow us to produce parts from simple heat spreaders such as graphite-based materials to Teflon-encapsulated shims for plasma resistance. With our extensive experience in film-based solutions, we work with you to define solutions that fit your specific needs using the optimum material for your requirements.

Specialty Interface Products include:

  • Sealers
  • Thermal Blockers
  • Gap Fillers
  • Heat Spreaders

Fralock’s engineered ceramics provide ideal solutions for high-temperature applications such as pedestal heaters with precise thermal control. Our heaters are also used in applications in which rapid thermal cycling is needed such as back-end packaging, chip-stacking, and testing.

Fralock’s engineered ceramics includes active circuit-based AlN (Aluminum Nitride) technology as well as structural machined ceramics. Structural ceramics capability covers all ceramic based materials, such as AlN, Al2O3, as well as quartz and sapphire glasses.

Ceramic Products Include:

Active Ceramics

  • Multi Layered, Cofired, Small-Format Test and Packing Heaters
  • Front End Heaters
  • Wafer Pedestal Heaters

 

Structural Ceramics

  • Front End Showerheads
  • End Effectors
  • Lift Pins
  • Precision ground vacuum wafer chucks
  • Shadow Rings
  • High-Temperature Dome Chambers
  • Wafer Susceptors for thermal PECVD deposition processes
  • PVD Target Isolation rings
  • ESC Electrical Chamber Isolation Plates
  • CMP Wear Rings
  • Zerodur Plates for advanced inspection metrology
  • Near net shape high voltage RF antenna supports
Rigid Flex Circuits

Flex Circuit Manufacturer for Semiconductor Equipment

Flex circuits are important components in the intricate and demanding environments of semiconductor manufacturing. The right flex circuit provider not only ensures the highest quality products, but also drives innovation that can significantly enhance the functionality of the equipment.

A primary benefit of partnering with a top-tier flex manufacturer is the assurance of quality and consistency. Fralock employs stringent quality control measures and advanced manufacturing processes to produce flex circuits that meet or exceed industry standards, indicated by our ISO 9001:2015 certification and other compliances.

Innovation is also critical for the rapid and continuous advancements in technology in the semiconductor industry. Partnering with a cutting-edge flex circuit manufacturer provides a critical advantage for semiconductor equipment manufacturers.

Fralock provides exceptional customer support and technical expertise to our customers. Understanding the needs and challenges of the semiconductor equipment manufacturing industry, we work closely with clients to develop customized solutions.

Fralock’s flex circuitry comprises a wide range of products from unstructured polyimide cables for long length high vacuum runs to highly complex flex and rigid-flex circuit assemblies for complex applications requiring 10 – 20 layer designs, and heaters. Our pioneered process for adhesiveless polyimide bonding enables us to provide fully-encapsulated, chemically-resistant flat flex cabling that can be used in high-temperature, harsh environments.

Our flex and rigid circuits offer resistance control, fine lines and spaces (trace / space  (1.5 mil), and protective coatings such as PTFE and conformal coating.

Common applications are robotics, metrology, and any moving part.