Thermal management is a critical aspect of designing electronics systems to ensure the reliable operation and longevity of electronic components. If incorrectly managed, overheating, damage to the system, and even hazardous occurrences can result.
Fralock has partnered with customers for over 50 years to provide passive thermal management solutions in critical applications, helping select materials, design, prototype, test, and manufacture thermal interface solutions to effectively manage heat and enable equipment to operate reliably. In some cases, we can even design custom materials for unique applications. Contact us for your specific needs.
Engineers frequently face challenges regarding:
- Heat Dissipation
- Thermal Blocking
- Material Selection
Efficient heat dissipation is necessary in electronic systems to prevent overheating. Fralock provides superior passive heat dissipation solutions to fit your application.
Thermal Interface Material (TIM) Solutions – We offer effective thermal spreaders to assure uniform heat dispersion across an entire surface (with TC-XY surface >200 W/m∙K).
Gap Pads/Gap Fillers – Thermal gap fillers are thermally conductive materials that eliminate air gaps between interfacing components and enhance efficiency of heat transfer. Fralock offers high thermally conductive silicone rubber gap fillers (with TC-Z surface as high as 17 W/m∙K) as thin as 0.3mm. We can assist in selection and precision manufacturing of complex thermal pads with very high thermal conductivity in the through-plane, providing excellent heat transfer. We also offer non-silicone based TIMs that include graphite, metal foils, and other thermally conductive gap pads.
One of our materials is Fralock Thermal Spreader AS which features the high thermal conductivity of aluminum while also functioning as a silicone gap filler. Get in touch with us about the material that best fits your application.
Passive thermal insulation is achieved by materials that retard or slow the transfer of heat from one surface to another. Thermal blocking is required for a variety of processes, and Fralock offers highly effective solutions using a variety of materials, including specialty polyimides, polyurethanes, polypropylenes, polycarbonates, silicones, aerogels, and others. These materials are available in various custom shapes, sizes, and thicknesses. DuPont™ Cirlex®, a thick polyimide exclusively manufactured by Fralock, is an ideal thermal barrier in extreme environmental conditions such as space.
Polyimide Thermal Blockers
Polyimide offers several benefits for thermal blocking, such as a wide operational temperature range, resistance to chemicals, radiation, and tearing. It is manufactured from thin sheet form, which is then machined, laser cut, or etched to fabricate the component that satisfies your needs. Cirlex® is thick Kapton® that is manufactured with our Adhesiveless Lamination Technology (ALT), producing a machinable monolithic material with no adhesive weaknesses.
Cirlex® is available in a wide range of sizes, thickness, and material properties, and is an ideal material for thermal stand offs, heat blockers, lid rings, gaskets, and washers.
Fralock’s TIMs: Thermal Pads and Gap Fillers
|Material Property||Type||Thermal Conductivity (W/mk)||Available Thickness(mm)||Operating Temperature||Flammability Rating|
|Thermally & Electrically Conductive Silicone||Silicone-based with carbon fibers||up to 50||0.1 to 3.0||Up to 150°C to 200°C||UL94 V0|
|Thermally & Electrically Conductive Graphite||Graphite with vertically oriented graphite fillers||25 - 45||0.15 - 2.0||Up to 200°C||--|
|Thermally Conductive & Electrically Insulating||Gap filler with silicone formulation||Up to 12||0.5 - 5.0||Up to 125°C to 200°C||UL94 V0|
|Other Options||Various||1 - 50||We can provide many other material options to meet your project-specific criteria. Please contact Fralock for assistance.|