|One of the core semiconductor devices is the Electro-Static Chucks (E-Chucks). It has been widely used in plasma-based and vacuum-based semiconductor processing. The electrostatic chuck plays an important role in adsorbing and cooling/heating wafers, and has technical advantages on non-edge exclusion, high reliability, wafer planarity, and particles reduction.
Fralock’s ALT is used to manufacture replaceable and reusable E-Chucks with accurate thermal controls that can increase processing rates in microfabrication processes and improve yields. Fralock’s ALT circuitry provides the highest level of thermal performance in wafer processing applications accommodating multiple zones and layers. Fralock has integration capabilities that are compatible with various metal and ceramic substrates depending on the specific application, including the addition of plasma-resistant substrates to reduce erosion rates during processing. Our technology allows the creation of very thin substrates (< 0.008”) which are bonded directly to the surface of Aluminum platens without the use of adhesives. E-chucks can be replaced and refurbished to extend the life of the platen, providing a cost-effective, yet technologically driven solution.
Fralock’s layered heaters provide the precision and flexibility needed to ensure the highest level of thermal performance in wafer processing applications.
They are designed with distributed power circuitry and can accommodate multiple zones and multiple layers. Fralock has a wide range of integration capabilities that are compatible with various metal and ceramic substrates depending on the application needs.
For complete technical information on Electro-Static Chucks (E-Chucks), contact Fralock today. Request a quote online or Call us at 1-800-FRALOCK (372-5625)
For additional information about us or to begin discussions on your project, click our Quote Request, or call 1-800-FRALOCK (372-5625)